RELIFE LS5 SE Heating and holding pressure palform LS5-SE
1.Camera cutout design, Supports most IP/Android phone models on the market, providing more even pressure.
2.Supports bidirectional dynamic holding pressure, freely switch between front and back pressure modes, suitable for phone screen bonding and frame reinforcement.
3.Adjustable temperature up to maximum of 80°C, fast heating, and precise temperature control.
4.Comes with camera avoidance design on the top and bottom, choose the proper position when using.
5.For screen lamination, frame reinforcement,etc.
Reviews
"Supports most IP/Android phone models on the market, providing more even pressure."
---Tim---
"freely switch between front and back pressure modes, suitable for phone screen bonding and frame reinforcement."
---Nina---
Sunshine World Map
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