RELIFE TK4 Multifunctional Glue Removal Blad

1.Multi-scene Adaptability: Glue removal/cutting/chip prying/CPU delamination/motherboard processing/frame adhesive removal/encapsulated IC dismantling... Covers all scenarios from precision electronics repair to industrial adhesive cleanup.

2.Precise Operation: Designed with differentiated blades for specific needs (e.g., dedicated treatment for motherboard upper layers/CPU adhesive/black adhesive), enabling flexible switching and efficient handling of complex conditions.

3.Sharp & Durable: Ultra-sharp blade design minimizes cutting/scraping resistance, with strong anti-roll-edge capability to maintain sharpness over extended use, reducing frequent replacement costs.

4.Safe & Reliable: Optimized for precision components (e.g., CPU chips), enabling precise force control during delamination/scraping to avoid accidental damage to core parts, ensuring safer repairs.

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