RELIFE TO6 Desoldering needle set TO6
1.Specially designed for motherboard repair desoldering, with a spherical head design that does not scratch or damage sockets and motherboards, especially suitable for bga package chip desoldering.
2.The needle tip uses high-purity copper with gold plating, improving tinning speed by 50%.
3.The ball head can reach into gaps, quickly complete pin header desoldering, and is not easy to scratch.
Reviews
"Specially designed for motherboard repair desoldering, with a spherical head design that does not scratch or damage sockets and motherboards, especially suitable for bga package chip desoldering"
---Earl---
"The needle tip uses high-purity copper with gold plating, improving tinning speed by 50%"
---Felix---
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