RELIFE RL-403C Lead-free hardcover solder balls RL-403C
1.Suitable for BGA package components such as CPU, power IC, baseband chip, etc. High-frequency plug-in or high-current components such as charging interface and battery contacts.
2.0.2~0.65MM various specifications to choose from, suitable for your various needs.
3.≈217~227°C high temperature melting point, suitable for high temperature resistant components or scenarios with strict environmental requirements.
Reviews
"Suitable for BGA package components such as CPU, power IC, baseband chip, etc. High-frequency plug-in or high-current components such as charging interface and battery contacts"
---Jack---
"0.2~0.65MM various specifications to choose from, suitable for your various needs"
---Philip---
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