RELIFE RL-403C Lead-free hardcover solder balls
1.Suitable for BGA package components such as CPU, power IC, baseband chip, etc. High-frequency plug-in or high-current components such as charging interface and battery contacts.
2.0.2~0.65MM various specifications to choose from, suitable for your various needs.
3.≈217~227°C high temperature melting point, suitable for high temperature resistant components or scenarios with strict environmental requirements.
Specifications
EAN(Gtin13): 6941590215006
Brand: RELIFE
Model: RELIFE RL-403C Lead-free hardcover solder balls
Sku: 1
Reviews
"Suitable for BGA package components such as CPU, power IC, baseband chip, etc. High-frequency plug-in or high-current components such as charging interface and battery contacts"
---Jack---
"0.2~0.65MM various specifications to choose from, suitable for your various needs"
---Philip---
Sunshine World Map
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