CPU SOLDER FLUX SSRMA-228
1.special for BGA IC.
2. Make of the newest rosin and other imported high-quality materials.
3.Main ingredients: imported rosin, high component thixotropic agent, antioxidant, stroma, and surfactants.
4.No corrosive, non-conductive, transparent.
5.Viscidity flux, less liquidity, it will not cross flow on the PCB.
6.No irritant smell, Good ability of infiltration, Utility persistent, No residue.
Reviews
"Easy on tin, less liquidity, good for use."
---Leopnard---
"No residue, good flux."
---Max---
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