CPU SOLDER FLUX SSRMA-228
1.special for BGA IC.
2. Make of the newest rosin and other imported high-quality materials.
3.Main ingredients: imported rosin, high component thixotropic agent, antioxidant, stroma, and surfactants.
4.No corrosive, non-conductive, transparent.
5.Viscidity flux, less liquidity, it will not cross flow on the PCB.
6.No irritant smell，Good ability of infiltration，Utility persistent，No residue.
Reviews
"Easy on tin, less liquidity, good for use."
---Leopnard---
"No residue, good flux."
---Max---
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