RELIFE IP series CPU integrated steel stencil set/8 pieces/IP6-13 series RL-044 IP
1.It is specially designed and used for mobile phone chips. The round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips.
2.Ultra-thin design, better fit of tin planting, continuous bending and full toughness.
3.High-quality special steel is selected, which has good high temperature resistance and metal fatigue resistance, so that each tin point is heated evenly.
4.Special chip half-cut + cut-through to meet different requirements.
5.Suitable for IP6G/6P/6S/6SP/7G/7P/8G/8P/X/XS/XS Max/XR/11/11 Pro/11 Pro Max/12/12 Mini/12 Pro/12 Pro Max/13/ 13 Mini/13 Pro/13 Pro Max.
Reviews
"Supports many models, very thin,very practical."
---James---
"Excellent tool, high temperature resistance and good metal fatigue resistance, very good."
---Peter---
Sunshine World Map
Contact Us Now
Soldering Consumable
Service Contact
Subsciption