PRECISION BGA STENCILS RL-044 PCIE NAND
1.Pioneering half etching process,let some components fit into the groove Protect components to avoid burns.
2.Cooling hole patented design,rapid heat dissipation to avoid damage to components due to excessive temperature.
3.Ultra-precise round square hole positioning,precision of hole,Round square hole design,Easy to take off the steel,Make the operation more smooth.
4.Double blister packaging，hard paper package ,protect the steel mesh from being crushed and deformed during transportation.
Model: RL-044 PCIE NAND
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