RELIFE MI series CPU integrated steel stencil set/15 pieces RL-044 MIS
1.It is specially designed and used for mobile phone chips. The round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips.
2.Ultra-thin design, better fit of tin planting, continuous bending and full toughness.
3.High-quality special steel is selected, which has good high temperature resistance and metal fatigue resistance, so that each tin point is heated evenly.
4.Special chip half-cut + cut-through to meet different requirements.
5.Applicable to most models of MI currently on the market.
Reviews
"Excellent customer service, delivery in estimated times and the product is of very good quality, keep doing it."
---Billy---
"Excellent tool, pioneering half etching process, very good."
---West---
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